Intel z590 release date

Intel z590 release date DEFAULT

PRO series helps users work smarter by delivering an efficient and productive experience. Featuring stable functionality and high-quality assembly, PRO series motherboards provide not only optimized professional workflows but also less troubleshooting and longevity.

Z A PRO

ZA PRO

EXCLUSIVE FEATURE

ZA PRO
Core Boost Technology

Core Boost Technology

Combining 8+4 pin power connectors and premium layout design, that is ready for unleashing the maximum performance.

6 layer PCB with 2oz Thickened Copper

6 layer PCB with 2oz Thickened Copper

6 layer PCB with 2oz thickened copper provides higher performance and long-lasting system stability without any compromise.

Digital PWM

Digital PWM

Highest quality component digital power IC makes sure your system runs smoothly under the most extreme conditions.

1

PCI-E Steel Armor

Protecting VGA cards against bending and EMI for better performance, stability and strength.

ZA PRO

premium thermal solution

ZA PRO
Extended Heatsink

Extended Heatsink

MSI extended PWM and enhanced circuit design ensures even high-end processors to run in full speed.

M.2 Shield Frozr

M.2 Shield Frozr

Strengthened built-in M.2 thermal solution. Keeps M.2 SSDs safe while preventing throttling, making them run faster.

Pump Fan Support

Pump Fan Support

Control watercooling pump speeds for best flow and noise control.

ZA PRO

HIGH-SPEED TRANSMISSION

ZA PRO
G Network Solution

G Network Solution

Featuring premium G LAN with LAN manager delivers better network experience.

Lightning USB 20G

Lightning USB 20G

Built-in USB Gen 2x2 port, offers the 20Gbps transmission speed, 4X faster than USB Gen 1.

DDR4 Boost

DDR4 Boost

The fully isolated DDR circuit to deliver pure data signals for the best gaming and overclocking performance.

Lightning Gen 4 Solution

Lightning Gen 4 Solution

The latest Gen 4 PCI-E and M.2 solution with up to 64GB/s bandwidth for maximum transfer speed.

USER FRIENDLY DESIGN

MSI motherboards feature tons of convenient and smart design for DIY users, countless system tuning and troubleshooting tools are at your disposal to push your system to new heights and satisfy even the most demanding tweaker. Makes it so easy to install your own motherboard without any issue.

CONNECTIVITY

The most important thing of DIY is expandability. MSI PRO series motherboards feature plenty possibility for prosumers’ need. Stable LAN, faster storage and USB transfer speed and other expandable connectors are ready to enlarge your flexibility.

EXPERIENCE MORE

MSI PRO series motherboards are designed to satisfy any professional workflow. Elevate your listening pleasure and enjoy extreme sound quality. Moreover, with years of experience in creating performance enhancing tools that are easy to use, only the highest quality applications are at your disposal. The extensive features let you fine-tune your system to deliver reliable maximum performance.

Intel, the Intel Logo, Intel Inside, Intel Core, and Core Inside are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

© NVIDIA Corporation. All rights reserved. NVIDIA, the NVIDIA logo, GeForce, GeForce RTX, and NVIDIA Turing are registered trademarks and/or trademarks of NVIDIA Corporation in the United States and other countries. All other trademarks and copyrights are the property of their respective owners

Brand and product names mentioned are trademarks of their respective owners.

HDMI

All images and descriptions are for illustrative purposes only. Visual representation of the products may not be perfectly accurate. Product specification, functions and appearance may vary by models and differ from country to country . All specifications are subject to change without notice. Please consult the product specifications page for full details.Although we endeavor to present the most precise and comprehensive information at the time of publication, a small number of items may contain typography or photography errors. Products may not be available in all markets. We recommend you to check with your local supplier for exact offers.

Sours: https://www.msi.com/Motherboard/ZA-PRO

1

Rear USB Gen2 Type-C®

4

Advanced Thermal Design
  1. Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
  2. 5 W/mK Thermal Conductivity Pad
  3. 2* M.2 Connectors with Thermal Guards
  4. Integrated IO Shield

5

Full PCI Express Design
  1. 1*PCIe x16 slot
  2. 1*PCIe x4 M.2

6

AMP-UP Audio
  1. High-End Audio Capacitor
  2. Audiophile Grade WIMA Capacitors

7

RGB FUSION
  1. Addressable LED Header*2
  2. RGB LED Header*2

8

8+4 Solid pin CPU Power Connector

9

Dual Channel DDR4, 4 DIMMs

10

Supports 11th Gen. Intel Core™ Processors

11

24 pin ATX Power Connector

12

Direct 12+1 Phases Digital Power Design with DrMOS
  1. 60A DrMOS
  2. Premium Choke and Capacitor
  3. 6 layer PCB
  4. PCIe Ready PCB
  5. 2X Copper PCB

13

Front USB Gen1 Type-C® for Connecting devices

14

3* M.2 Connectors
  1. 1*PCIe x4 M.2
  2. 2*PCIe x4 M.2
  3. Thermal Guards

15

Q-FLASH Onboard Button

DIRECT POWER DESIGN

Z GAMING X motherboard uses an 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These % digital controller and additional 8+4 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.

Power Design Efficiency

PERFORMANCE

With the best quality components and GIGABYTE R&D design capability, the Z GAMING is a true beast among motherboards.

    Support for DDR4 XMP Up to MHz and Beyond*

    GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GAMING motherboard.

    * XMP Profile support may vary depending on memory module.
    Please see the complete validated memory support list. Product features may vary by model.

    Shielded Memory Routing

    All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.

    Memory Layout - Daisy Chain Design

    With the optimized daisy-chain routing, the Z GAMING motherboard provides a proven speed of up to DDR+ MHz with high-density Memory module*. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in dual channel interleaving mode to hit higher memory frequencies, providing professional gamers a denser and faster system memory experience.

    * Performance may vary in circumstances. Please refer to the QVL list for detail support information.
    ** Photo for reference only.

    Single 32GB Support

    The maximum memory capacity on the Z motherboard is GB. After Intel updated the memory reference code, a single slot can support up to 32GB. Therefore with populated 2 DIMM per channel on both channel, total memory capacity is GB, which was only available on High End Desktop (HEDT) platforms. For users who always run out of memory capacity, there is more bandwidth now for memory-intensive application such as rendering and video editing.

      1. 1X PCIe M.2 Slot

      M.2 PCIe x4 with lower impedance.

      2. 1X PCIe Slot

      Reinforced PCIe x16 with lower impedance.


      * Product uses PCIe grade materials,actual support varies by CPU.

      Fully Covered MOSFET heatsink

      ADVANCED THERMAL SOLUTION

      Z GAMING X uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers.

      1. Fully Covered Thermal Design

      High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.

      2. Thick Thermal Pad

      Thick Thermal Pad up to 5W/mK Thermal Conductivity.

      3. 2X M.2 Thermal Guards

      Built-in M.2 heatsinks prevent high-speed, large capacity PCIe / SSDs from throttling due to overheating.

      1. 2X larger Surface

      Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

      2. Real One-piece Build

      TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.

      3. Multi-cut Design

      TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.

      M.2 Thermal Guard

      GIGABYTE Ultra-Efficient M.2 Thermal Guard

      With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

      Thermal Throttling As Temperature Rises

        Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.

        Headers & Sensors

        5 PWM/DC Fan Headers
        6 Internal Temperature Sensors

        Cooling Features

        • High Current Support

          Each fan headers support PWM and DC fan and Water cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection
        • Precision Control

          7 temperature/fan speed control points for precise fan curve
        • Dual Curve Mode

          Slope/Stair dual mode for different user scenario
        • Fan Stop

          Fan can stop completely below users' specified temperature point

        Smart Fan 6 BIOS UI

        We increase control points from 5 to 7 and larger fan speed graph for precise and easier fan curve control.

        2

        Slope/Stair dual graph mode

        Fan curve can be quickly switch with Slope and Stair modes for different user scenario. Slope is traditional and intuitive linear fan speed curve. With newly added Stair non-linear mode, fan keeps at same speed between specified temperature interval.

        For advanced users, we provide fan speed manual input for more precise control.

        Use can place 4 EZ Tuning points at rough temperature/fan speed, and Smart Fan 6 can quickly generate a fan curve.

        Fan curve profile can be saved in BIOS ROM, profile will be kept after updating BIOS.

        Achieve fan silence. With Fan Stop, map any fan to stop completely when temperatures drop below a specified threshold. Which fan stops, based on readings from which sensor, and at what temperature—all of it can be customized to your liking.

        Intelligent Fan Control Design

        Intel® USB Gen2 Type-C® Support

        NEXT GENERATION CONNECTIVITY

        A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. Z GAMING X provides all next generation network, storage, connectivity to keep you up to speed.

        Intel GbE LAN Onboard


        2X Faster than ever

        1. Adoption of G LAN provide up to GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
        2. Support Multi-Gig(10///Mbps) RJ ethernet

        Intel® USB Gen 2 Type-C® Controller

        Intel's native USB Gen2 host controller provides USB Gen2 ports with speeds up to 10Gbps .With twice the bandwidth compared to its previous generation as well as backwards compatibility with USB and USB Gen1 , the much improved USB Gen2 protocol is available over the new reversible USB Type-C® and the traditional USB Type-A connector for better compatibility over a wider range of devices.

        High-End Audio Capacitors

        GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.

        Audio Noise Guard

        GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.

        DEFINITIVE AESTHETICS

        Z GAMING X features RGB FUSION and offers users the option to control onboard, external light strips, and/or GIGABYTE devices with RGB/ Addressable RGB LEDs to make their PC more unique and stylish.

        Multi-Zone Light Show Design

        Sours: https://www.gigabyte.com/Motherboard/ZGAMING-X-rev-1x
        1. Crossbreed holster for 1911
        2. Kiss diy acrylic nails
        3. Biology midterm quizlet
        4. Used toyota under 7000
        5. Rogue fitness dumbbell bumpers

        The Intel Z Motherboard Overview: 50+ Motherboards Detailed

        At the start of , Intel has unveiled its latest desktop platform, designed primarily for its Rocket Lake 11th generation processors. Intel is officially moving to PCIe , with the top SKU Core iK supposedly offering a large jump in IPC performance compared to the previous generation. The new chipset moves to double bandwidth to the CPU, allowing for more hardware to make the most of the chipset at once. It also moves to DDR support, a new peak in a product line that was previously on DDR The new Z chipset is Intel's flagship, designed for Rocket Lake, but offering backward compatibility with Comet Lake processors. We take a closer look at the large variety of new motherboards set to come to market.

        As is usual with a new platform launch, we reached out to every motherboard vendor for their Z model list, images, and specifications. Every vendor we spoke to had something on hand, however some products are still under development for launch over the next couple of months. As a result, we have put as much information as we have into this single article to date, and as information is provided, this article will be updated. At the time of publication, we have details of 50+ motherboards. We will endeavor to keep this Z overview updated with the latest information, including pricing and new models.

        Intel Z Chipset: Double Bandwidth to the CPU

        Due to the size of the core being used, the newest Rocket Lake flagship is only 8 cores compared to the previous generation's 10, but by contrast, Intel has put a few new features onto the leading flagship chipset, and a number of vendors are straight out of the gate with a wide variety of models and price points. There are two (or three)big differences between the new Z and the previous flagship Z

        First up is the CPU-to-chipset link, which has been doubled from a DMI x4 link to a DMI x8 link. This means an effective CPU-to-chipset bandwidth of a PCIe x8 link, and suggests that two PCIe x4 drives can be attached and run at full speed.Out of all the series chipsets, we are under the impression that Z is the only one that will do this, with all others forcing an x4 link. Also, the x8 link only works with Rocket Lake CPUs, and will downgrade to x4 with a previous generation processor.

        The second big difference is that the Z platform will enable the processor to use PCIe Intel will include native CPU PCIe support for the first time, 20 lanes of it, which will enable a full x16 link for add-in cards as well as another PCIe x4 for storage. Vendors will be able to split that x16 as required, similar to previous mainstream motherboards, into an x8/x8 or x8/x4/x4 bifurcated solution, with appropriate muxing.

        The third update is native USB G2x2 (20 Gbps) Type-C support from the chipset. Motherboards that take advantage of this feature will likely enable it either on a front panel or rear panel connector, although it is optional and some of the cheaper models might not have the port.

        Intel is also offering better memory support on its 11th Generation processors, which have been upgraded from DDR to DDR This means that motherboard vendors are building the base specifcation to meet this DDR at JEDEC specifications, but most will go beyond this for overclocked memory. Due to the ratio jump, it means that we have motherboards offering up to DDR, although buying that memory will cost a lot of money. Note that memory profiles higher than DDR are classified as overclocking, which officially nullifies any warranty. Intel does in itself offer what it calls PTPP, the Intel Performance Tuning Protection Plan, which is a warranty that can be purchased directly from Intel for an additional cost.

        Intel Z, Z, and Z Chipset Comparison
        FeatureZZZ
        SocketLGALGALGA
        PCIe Lanes (CPU)201616
        PCIe Specification (CPU)*
        PCIe Configx16
        x8/x8
        x8/x8/x4+4
        x16
        x8/x8
        x8/x8/+4
        x16
        x8/x8
        x8/x4/+4
        DMI Lanes ()x8 (RKL)x4x4
        Chipset PCIe Lanes242424
        Max USB (Gen2/Gen1)6/10?6/106/10
        USB Gen 2x2 (20 Gbps)YASMediaN
        Total USB141414
        Max SATA Ports666
        Memory Channels (Dual)2/22/22/2
        Intel Optane Memory SupportYYY
        Intel Rapid Storage Technology (RST)YYY
        Max Rapid Storage Technology Ports?33
        Integrated WiFi MACWi-Fi 6Wi-Fi 6Wi-Fi 5
        Intel Smart SoundYYY
        Integrated SDXC (SDA ) Support??Y
        Overclocking SupportYYY
        Intel vProNNN
        Max HSIO Lanes?3030
        ME Firmware151412
        TDP (W)666

        The new Intel Z chipset now includes native support for USB Gen 2x2 20 Gbps Type-C connectivity. On the previous Z chipset, vendors needed to use additional controllers, such as the ASMedia ASM, plugged into the PCIe lanes from the chipset.

        Networking is also a focal point for vendors, with Intel continuing to build in a native Wi-Fi 6 MAC into the chipset, accessible through Intel's proprietary CNVi interface. Vendors will enable this through Intel's latest AX or AX Wi-Fi 6 RF modules, or the new Intel Killer AX (because if you hadn't heard, Intel purchased the company behind the Killer networking chips).

        For wired connectivity, Intel identifies support for gigabit Ethernet as a key feature for the new chipsets, however this isn't anything special, as it works the same as in previous generations - motherboard vendors just buy a GbE PCIe chip and attach it to the chipset. Though usually when Intel advertises it like this, then there's a combo sale for vendors who buy the chipset along with the Intel branded network controller, so we're going to see a push for GbE networking on Z

        Intel Thunderbolt 4: Support for Maple Ridge

        Another new feature found on Z models is Intel's Maple Ridge Thunderbolt 4 connectivity. Despite there being little difference between Thunderbolt 4 and the previous Thunderbolt 3, as both allow for 40 GBs of bandwidth and both can drive additional displays, TB4 does offer the full specification standard. Thunderbolt 4 comes with additional security through Intel VT-d DMA protection, can support longer cables with lengths of up to 2 meters, and also tree/branch daisy chaining, whereas previously only linear chaining was supported.

        Another benefit for users looking to attach extra screens is Thunderbolt 4 can support up to two 4K and one 8K display, which is a marked improvement over Thunderbolt 3. Systems that want to enable TB4 will do it though the vendor integrating the Maple Ridge chip on the board, as with any other external (external to the chipset) controller.

        The Current Z Product Stack:

        Motherboards Confirmed So Far (as of 01/19)

        Through our contact with vendors, we anticipate a total of 55+ models for Z Most of these are currently announced and detailed, with a small number announced but waiting for a full detail. Simply put, there will be no shortage of models to select from. Although users might start to baulk at the pricing, with only a small number of boards dipping below the $ mark.

        Surprisingly there isn't much in the way of micro-ATX for Z, with availability looking limited. We have some mATX from Chinese vendor Colorful, one from ASRock, ASUS and MSI, but little else. For small form factor enthusiasts, ASRock, GIGABYTE, and MSI include a small selection of mini-ITX boards. The vast majority of the Z product stack is ATX, although the flagship models from each brand feature E-ATX PCBs with a large selection of PCIe, storage, and premium controller options.

        ASRock

        ASRock's product stack includes the return of its Phantom Gaming series, which focuses on gaming elements, with the Taichi sitting at the top as the brand's flagship Z model. The entry-level Pro 4 series offers an ATX and micro-ATX version, while ASRock's only mini-ITX board to be announced at this time comes via the ZM-ITX/ac.

        ASRock Z Motherboard Product Stack
        ModelSizeOverview
        Link
        Review
        Link
        Price
        ASRock Z TaichiATXLink TBC
        ASRock Z PG VelocitaATXLink TBC
        ASRock Z Extreme WiFi 6EATXLink TBC
        ASRock Z ExtremeATXLink TBC
        ASRock Z Steel Legend 6EATXLink $
        ASRock Z Steel LegendATXLink $
        ASRock Z Phantom Gaming 4 ACATXLink TBC
        ASRock Z Phantom Gaming 4ATXLink TBC
        ASRock Z Pro 4ATXLink TBC
        ASRock ZM Pro 4mATXLink TBC
        ASRock ZM-ITX/acITXLink TBC

        ASRock will likely announce even more models for Z, as the custom monoblock Z Aqua is a potential model that could be announced at a later date. We also expect a Phantom Gaming mini-ITX model at some point, which typically offers plenty of premium features. 

        ASUS

        As is typical with ASUS, it has a large Z stack, and we have information available for most of its Z models; some information is still yet to be announced, however. Some of the models yet to be fully unveiled include the overclocking focused Maximus XIII Apex (Q1), and the Maximus XIII Extreme Glacial with a custom EK monoblock and the standard Extreme variant (also Q1). The usual suspects make its way onto Z, including the ROG Maximums XIII series, now in its 13th iteration, as well as the mid-range ROG Strix, the budget-focused TUF Gaming, and Prime series.

        ASUS Z Motherboard Product Stack
        ModelSizeOverview
        Link
        Review
        Link
        Price
        ASUS ROG Maximus XIII Extreme GlacialE-ATXLink TBC
        ASUS ROG Maximus XIII ExtremeE-ATXLink TBC
        ASUS ROG Maximus XIII HeroATXLink $
        ASUS ROG Maximus XIII Apex?  TBC
        ASUS ROG Strix ZE Gaming WIFIATXLink $
        ASUS ROG Strix ZF Gaming WiFiATXLink TBC
        ASUS ROG Strix ZA Gaming WiFiATXLink $
        ASUS ROG Strix ZI Gaming WiFiITXLink $
        ASUS TUF Gaming ZPlus WIFIATXLink $
        ASUS TUF Gaming ZPlusATXLink $
        ASUS Prime ZAATXLink $
        ASUS Prime ZPATXLink $
        ASUS Prime ZM-PlusmATXLink $

        From the pricing information we have on hand, ASUS's cheapest model will be the ASUS Prime ZM-Plus, micro-ATX. The entry-level Prime series focuses on basic yet subtle aesthetics, with prices starting upwards of $ ASUS will also be launching a Strix series mini-ITX model, the ASUS ROG Strix ZI Gaming WiFi, but there isn't much in the way of information. We will keep things updated, though, as more details are made available.

        Biostar

        Biostar has announced a trifecta of models for Z, with its top model, the Z Valkyrie sitting as one of the most premium desktop models we have seen from them in a long time. The latest Valkyrie series uses the native USB Gen 2x2 Type-C support, gigabit Ethernet, and has a fresh and funky design. Biostar's Racing series is also back for Z through the ZGTA model, with an ATX PCB and a solid entry-level feature set.

        Biostar Z Motherboard Product Stack
        ModelSizeOverview
        Link
        Review
        Link
        Price
        Biostar Z ValkyrieATXLink TBC
        Biostar ZI ValkyrieITXLink TBC
        Biostar Racing ZGTAATXLink TBC

        Biostar is usually a sure thing for at least one mini-ITX model per chipset, and the ZI Valkyrie is the smaller sibling of the ATX model. It seems like Biostar has gone all out on its Valkyrie models to use the Z chipset to its fullest, especially with support for up to DDR and GbE with premium HD audio codecs.

        GIGABYTE:

        GIGABYTE has the largest stack with 15 new models unveiled at present. Starting from the top with the GIGABYTE Z Aorus Xtreme WaterForce, it caters to the enthusiast market, with top tier level features and a custom monoblock for custom liquid cooling. The Aorus Z Xtreme has the same PCB, without the monoblock, and the Aorus range extends from the top end down to the mid-range.

        GIGABYTE Z Motherboard Product Stack
        ModelSizeOverview
        Link
        Review
        Link
        Price
        GIGABYTE Z Aorus Xtreme WaterForceE-ATXLink TBC
        GIGABYTE Z Aorus XtremeE-ATXLink TBC
        GIGABYTE Z Aorus MasterATXLink TBC
        GIGABYTE Z Aorus TachyonATX  TBC
        GIGABYTE Z Aorus Pro AXATXLink TBC
        GIGABYTE Z Aorus UltraATXLink TBC
        GIGABYTE ZI Aorus UltraITXLink TBC
        GIGABYTE Z Aorus Elite AXATXLink TBC
        GIGABYTE Z Aorus EliteATXLink TBC
        GIGABYTE Z Gaming XATXLink TBC
        GIGABYTE Z Vision DATXLink TBC
        GIGABYTE ZI Vision DITXLink TBC
        GIGABYTE Z Vision GATXLink TBC
        GIGABYTE Z UD ACATXLink TBC
        GIGABYTE Z UDATXLink TBC

        Offering a more modest feature set with more cost-effective controllers, the Z Gaming X sits just below the Aorus series. In contrast, the Vision series returns with a refreshed Vision D (Designare) and a new Z Vision G model with slightly fewer features. GIGABYTE has two mini ITX models, the ZI Aorus Ultra and the content creator focused ZI Vision D. For users looking for a more affordable and lower entry point, GIGABYTE has two Ultra Durable series models, the Z UD and Z UD AC, with the only difference being the latter includes a Wi-Fi module.

        MSI

        MSI has also gone all out with its Z range, with at least 13 new models and more potentially on its way, including an EK monoblock Carbon X version. The MEG, MPG, MAG, and Pro series all return for Z, with the MEG Godlike sitting as the current flagship with a premium feature set throughout. The Unify range makes a return with an ATX and mini-ITX pairing. The MPG series, which is aimed at gamers with performance in mind, dominates the brand's mid-range, with pricing starting at $ up to $ The cheapest starts at $

        MSI Z Motherboard Product Stack
        ModelSizeOverview
        Link
        Review
        Link
        Price
        MSI MEG Z GodlikeE-ATXLink $
        MSI MEG Z AceATXLink $
        MSI MEG Z Ace Gold EditionATXLink -
        MSI MEG Z UnifyATX  $
        MSI MEG Z Unify-X?  -
        MSI MEG ZI UnifyITXLink $
        MSI MPG Z Gaming Carbon WiFiATXLink $
        MSI MPG Z Gaming ForceATXLink $
        MSI MPG Z Gaming Edge WiFiATX  $
        MSI MPG ZM Gaming Edge WiFimATX  -
        MSI MPG Z Gaming PlusATX  $
        MSI MAG Z Tomahawk WiFiATXLink $
        MSI MAG Z TorpedoATXLink $
        MSI Z Pro WiFiATXLink $
        MSI Z A ProATXLink $
        MSI Z Pro 12VOATX  TBC

        Geared more at the entry-level, the MAG series fires out a Torpedo, and while it might not dent the flagships solely on features, it certainly makes a splash. This is in addition to the Tomahawk which is commonly associated as one of the best models based on price to performance on the market. Lastly, MSI has its Pro series, which targets professionals, and MSI announces a 12VO variant without the need for the 5 V and V rails.

        Other Z Product Stack Options

        There are quite a few models outside of the major players.

        EVGA is planning on announcing its E-ATX sized overclocking focused EVGA Z Dark model sometime later in the year. Primarily designed for overclocking, the EVGA Z Dark includes just two memory modules, which are designed to reduce trace latencies for breaking memory world records under liquid nitrogen, with a transposed socket for better LN2 pot mounting. The EVGA Z FTW veers off to the more conventional styled motherboard with features aimed at gamers and enthusiasts alike.

        Colorful predominantly aims its models at the Asian market with its iGame series and its take on the American Naval fleet with the CVN series.

        Supermicro also has two models, one with Wi-Fi and one without, although neither of these includes a PLX chip, which has been a feature in previous generations. This could be an option further down the line.

        Other Z Motherboards
        ModelSizeOverview
        Link
        Review
        Link
        Price
        Colorful iGame Z Vulcan XATXLink TBC
        Colorful iGame Z Vulcan WATXLink TBC
        Colorful CVN Z Gaming Pro V20ATX  TBC
        Colorful CVN Z Frozen V20ATX  TBC
        Colorful CVN ZM Gaming Pro V20mATX  TBC
        Colorful CVN ZM Frozen V20mATX  TBC
        EVGA Z DarkE-ATXLink TBC
        EVGA Z FTWATXLink TBC
        Supermicro C9ZCGWATXLink TBC
        Supermicro C9ZCGATXLink TBC


        On the next page is a summary of each Z model power delivery from information which we received from manufacturers or through analysis of the physical board. Each subsequent page is a brief analysis and rundown of each model announced, culminating with a conclusion of board features versus other models.

        Sours: https://www.anandtech.com/show//the-intel-zoverview

        Intel Z, B and H motherboard platform to be launched at CES

        In Q1 , Intel is expected to release Rocket Lake, the new 11th generation of  desktop processors, still using 14nm manufacturing process, but with a new architecture, PCIe and probably much higher single-threaded and gaming performance. According to rumors, the CPU launch should be in March, but it looks like the platform with new motherboards, such as B, Z, etc. could be released sooner, as early as a few days from now.

        Rocket Lake processors use the same LGA socket as current Comet Lake chips and are supposed to work on boards with series chipsets as long as you have the appropriate BIOS upgrade. After all, many of those boards support PCIe in advance for this very reason. But Intel is also readying new series chipsets for the new CPUs, and new motherboards should also be available for sale supporting Rocket Lake &#;out of the box&#;. Information on those has started to trickle in, and if the latest gossip isn&#;t wrong, these boards could even start selling before the CPUs themselves.

        Poster on chinese social network WeChat (it reached us on the west via a Twitter account) Harukaze and VideoCardz) has leaked that Intel should officially unveil and even allegedly launch these motherboards (or at least the chipsets) on January 11th. The CES event in its virtual form officially begins that day, so the platform for Rocket Lake could be introduced as part of the announcements Intel has prepared for the event.

        However, the processors are not supposed to be released at that time, for the report actually directly states that they are still planned for release at the beginning of March or at best the end of February. The new boards would thus be released in advance of the CPUs. This isn&#;t something that&#;d pose problems – the bords can be used with the 10th generation of CPUs too, and this way compatible boards will be readily available on the day the new processors are released.

        But there is also some possibility that the January 11 release turns out to be a paper launch and in reality the series boards would only reach stores with some delay. This possibility is not not entirely unlikely as there have not been many leaks of motherboards with these new chipsets so far. The stated introduction date is just some two weeks away and in the past, photos of motherboards, catalog listings or at least names would typically be leaking up to some two months prior to a product launch (which has not particularly played out yet, this time).

        DDR4 overclock on B, Superspeed USB 20Gbps

        According to the report on WeChat, the Z chipset boards (which will be the successor to the Z generation with overclocking support), and at least the B and H chipset boards are to be included in the january unveiling, meaning that the lower price tiers should be covered right from the start as well.

        According to previous leaks, the B platform should gain the ability to raise the DDR4 frequency above the officially supported level, either viaXMP profile or by direct overclocking. This is something that proved limiting on the current B chipset, and with this change the B should be quite a bit better platform for gaming PCs. Core i7 and i9 processors have relatively little room for manual OC these days, so RAM overclocking and possibly a TDP increase on a B board might actually be enough to get near-perfect gaming performance even if B won&#;t allow you to change the CPU&#;s multiplier.

        We don&#;t know yet for certain if the Bseries boards will also support PCI Express We assume it will since lack of PCIe would harm their competitiveness vis-a-vis the AMD B platform. PCIe could however be missing in the cheapest boards using the H chipset (the same is true with AMD A). As for other news about these chipsets, we saw reports that the Intel series chipsets should be the first to support USB Gen 2&#;2 with speeds of up to 20 Gb/s. HDMI output from integrated GPU should also finally work with Rocket Lake processors.

        English translation and edit by Lukáš Terényi

        Back to: Intel Z, B and H motherboard platform to be launched at CES

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        chipletsIntelIntel LGA PCIe Rocket Lake

        Sours: https://www.hwcooling.net/en/zmotherboards-for-intel-rocket-lake-to-be-released-in-january/

        Release date z590 intel

        Intel® Z Chipset

        All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

        Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

        Refer to Datasheet for formal definitions of product properties and features.

        &#; This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

        “Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

        System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

        WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit http://www.intel.com/content/www/us/en/gaming/overclocking/overclocking-intel-processors.html

        Sours: https://www.intel.com/content/www/us/en/products/sku//intel-zchipset/specifications.html
        The ULTIMATE Intel Z590 Motherboard Roundup Review [11 Motherboards BENCHMARKED]
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        ASUS Z SERIES

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        ASUS Z series motherboards are designed to extract every ounce of performance from the latest 11th Gen Intel® Core™️ processors. Updated power designs underpin the entire lineup, which is further enhanced with the latest connectivity options and boosted by slick features that leverage Artificial Intelligence to put advanced performance at your fingertips.

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        Our latest audio utility leverages a massive deep-learning database to reduce background noise from the microphone* and incoming audio. Distracting keyboard clatter, mouse clicks and other ambient noises are smartly pared back so you can hear and be heard with crystal clarity while gaming or in calls.

        *An audio splitter ( mm audio jack Y-cable) is necessary when using a mm headset.
        • M

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        COD: MW - FPS ( x )

        ASUS Two-Way
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        Similar technology

        • Disabled:

        • Disabled:

        Minimal

        performance impact

        *Testing configuration: CPU: 11th Gen Intel Core Processor ; Motherboard: ROG MAXIMUS XIII HERO; Graphics card: NVIDIA RTX ; DRAM: G.SKILL FC16QGVK; Power: SUPER FLOWER W; HDD: ADATA SX SSD G; Cooling: Enermax T.B.APOLLISH; Game: CALL OF DUTY: MODERN WARFARE ; Voice Communication App: Discord (In-app noise canceling effects disabled) ; Background noise: Keyboard typing, mouse clicking, people talking, and music playing
        *Actual performance varies by configuration
        COD: MW - FPS ( x )

        Hear the difference

        micsound
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          ASUS Motherboard User

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        ROBUST POWER & COOLING

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          ASUS Z motherboards utilize teamed power-stages and high-quality components to fuel the latest 11th Gen Intel Rocket Lake CPUs. Even at entry level, the power solutions are geared to deliver sustained performance, and through the lineup those credentials are strategically scaled up to push boundaries and set new standards.

          Learn More about ASUS Teamed Power Design
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          To ensure system stability under heavy CPU loads, ASUS Z motherboards employ large VRM and chipset heatsinks that strike the right balance between surface area and mass. That same philosophy also extends to onboard M.2 heatsinks, ensuring readiness for the next wave of PCIe SSDs.

        • Thunderbolt 4

          ASUS Z motherboards offer up to two onboard Thunderbolt 4 USB-C® ports, each providing up to 40 Gbps of bidirectional bandwidth for the latest high-speed devices and drives.

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          Ready for the latest high-performance routers, Intel G Ethernet provides up to a X improvement over standard Ethernet connections, delivering blazing file transfers, smoother lag-free gaming and high-res video streaming.

        Next-gen connectivity
        Intel® Wi-Fi 6E (Gig+)

        Intel® Wi-Fi 6E (Gig+)

        The ROG Z series features WiFi 6E technology, which takes advantage of the newly available radio spectrum in the 6 GHz band. WiFi 6E has triple the bandwidth of the 5 GHz band and up to seven MHz frequency bands to deliver ultrafast wireless-networking speeds, improved capacity and better performance in dense wireless environments.



        *WiFi 6E availability and features are dependent on regulatory limitations and co-existence with 5 GHz WiFi.
        To learn more about the ASUS WiFi 6E ecosystem, please visit: asus.com/content/WiFi6/#WIFI-6E
        M.2 Q-Latch

        M.2 Q-Latch

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        ASUS SERIES MOTHERBOARDS

        ROG Maximus XIII Extreme Glacial

        ROG Maximus XIII Extreme Glacial

        • EATX

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        • Integrated EK water block

        • Five M.2 heatsinks and embedded backplates

        • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

        • Marvell® 10 Gb, Intel® Gb Ethernet, Intel WiFi 6E

        • PCIe® ready*, onboard Thunderbolt™ 4 Type-C® port

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        ROG Maximus XIII Extreme

        ROG Maximus XIII Extreme

        • EATX

        • 18+2 power stages

        • OptiMem III

        • Five M.2 heatsinks and embedded backplates

        • PCIe®  ready*, onboard Thunderbolt™ 4 Type-C® port

        • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

        • Marvell® 10 Gb, Intel® Gb Ethernet, Intel WiFi 6E

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        ROG Maximus XIII Hero

        ROG Maximus XIII Hero

        • ATX

        • 14+2 power stages

        • OptiMem III

        • Four M.2 with heatsinks and embedded backplates

        • PCIe® ready*, onboard Thunderbolt™ 4 Type-C® port

        • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

        • Intel® WiFi 6E, dual Intel®  Gb Ethernet

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        ROG Strix ZE Gaming WIFI

        ROG Strix ZE Gaming WIFI

        • ATX

        • 14+2 power stages

        • OptiMem III

        • Four M.2 with heatsinks and an embedded backplate for PCIe M.2 slot

        • PCIe®  ready*, Thunderbolt™ header

        • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

        • Intel® WiFi 6E, dual Intel® Gb Ethernet

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        ROG Strix ZA Gaming WIFI

        ROG Strix ZA Gaming WIFI

        • ATX

        • 14+2 Power Stages

        • OptiMem II

        • Trio M.2 with heatsinks and an embedded backplate

        • PCIe Ready* and USB Gen 2x2 Type-C®

        • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

        • Intel® WiFi 6, Intel Gb Ethernet

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        ROG Strix ZI Gaming WIFI

        ROG Strix ZI Gaming WIFI

        • mini-ITX

        • 8+2 Power Stages

        • OptiMem II

        • Two M.2 with heatsinks and an embedded backplate

        • PCIe Ready*, onboard Thunderbolt™ 4 Type-C® port, and USB Gen 2x2 Type-C®

        • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

        • Intel® WiFi 6E, Intel Gb Ethernet

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        TUF Gaming Z Plus WIFI

        TUF Gaming Z Plus WIFI

        • ATX

        • 14+2 DrMOS power stages

        • OptiMem II

        • Enlarged VRM and two M.2 heatsinks

        • Intel® WiFi6 (AX), Intel Gb Ethernet

        • PCIe®  ready*, USB Gen 2x2 Type-C®, Thunderbolt™ 4 header, Three M.2 slots

        • Two-Way AI Noise Cancelation

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        Prime ZA

        Prime ZA

        • ATX

        • 14+2 DrMOS power stages

        • OptiMem II

        • VRM and two M.2 heatsinks

        • Intel® Gb Ethernet

        • PCIe®  ready*, USB Gen 2x2 Type-C®, Thunderbolt™ 4 header, Three M.2 slots

        • AI Overclocking, AI Cooling, and Two-Way AI Noise Cancelation

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        *Listed specifications are based on 11th Gen Intel® Core™ processors. Specifications may vary based on CPU used.

        TUF GAMING HPRO WIFI

        TUF GAMING HPRO WIFI

        • ATX

        • 8+1 DrMOS power stages

        • OptiMem II

        • VRM and three M.2 heatsinks

        • Intel® Wi-Fi 6, Gb Ethernet

        • PCIe® ready*, USB Gen 2x2 Type-C®, Thunderbolt™ 4 header, three M.2 slots

        • Two-Way AI Noise Cancelation

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        PRIME HPLUS

        PRIME HPLUS

        • ATX

        • 8 power stages

        • OptiMem

        • VRM and M.2 heatsinks

        • Intel® 1 Gb Ethernet

        • PCIe® ready*, USB Gen 2 Type-C®, Thunderbolt™ 4 header

        • Two M.2 slots

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        PRIME HM-PLUS

        PRIME HM-PLUS

        • Micro ATX

        • 8 power stages

        • OptiMem

        • VRM heatsink

        • Intel® 1 Gb Ethernet

        • PCIe® ready*, USB Gen 2 Type-C®, Thunderbolt™ 4 header

        • Two M.2 slots

        Learn more



        *Listed specifications are based on 11th Gen Intel® Core™ processors. Specifications may vary based on CPU used.

        ROG STRIX BF GAMING WIFI

        ROG STRIX BF GAMING WIFI

        • ATX

        • 8+2 Power Stages

        • OptiMem II

        • PCIe Ready* and USB Gen 2x2 Type-C®

        • Intel® Wi-Fi 6 (AX), Intel Gb Ethernet

        • Three M.2 slots with heatsinks

        • Two-Way AI Noise-Cancelation

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        ROG STRIX BG GAMING WIFI

        ROG STRIX BG GAMING WIFI

        • mATX

        • 8+2 Power Stages

        • OptiMem II

        • PCIe Ready* and USB Gen 2x2 Type-C®

        • Intel® Wi-Fi 6 (AX), Intel Gb Ethernet

        • Two M.2 slots, with one slot featuring its own heatsink

        • Two-Way AI Noise-Cancelation

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        TUF GAMING BPLUS WIFI

        TUF GAMING BPLUS WIFI

        • ATX

        • 8+1 DrMOS power stages

        • OptiMem II

        • VRM and M.2 heatsinks

        • Intel® Wi-Fi 6, Gb Ethernet

        • PCIe® ready*, USB Gen 2 Type-A®, Thunderbolt™ 4 header, two M.2 slots

        • Two-Way AI Noise Cancelation

        Learn more

        PRIME BPLUS

        PRIME BPLUS

        • ATX

        • 8 power stages

        • OptiMem

        • VRM and M.2 heatsinks

        • Intel® 1 Gb Ethernet

        • PCIe® ready*, USB Gen 2 Type-A®, Thunderbolt™ 4 header

        • Two M.2 slots

        Learn more



        *Listed specifications are based on 11th Gen Intel® Core™ processors. Specifications may vary based on CPU used.

        Select Your Components

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        REPUBLIC OF GAMERS

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        In order to participate in this campaign you need to be over 18 years old or your parent’s approval. We reserve the right to determine which contribution that qualifies for the campaign. A jury of ASUS marketing department will determine this and ASUS decision is final. The competition is not open to employees of ASUS or its affiliates.

        ASUS reserves the exclusive right to exclude any entrant from the competition if we suspect that this violates the contest rules, threaten or otherwise attempt to get advantage or try to sabotage the contest. The prize will be shipped by the 30th of April Your comment/video may not contain material that it deems offensive or insulting. The gifts are not exchangeable for cash. The campaign is in no way sponsored, recommended, administered or associated with 3rd parties. ASUS is not responsible for any technical difficulties or problems that may affect your participation in the campaign. Responsible for the contest are: ASUS GLOBAL PTE. LTD., 15A CHANGI BUSINESS PARK CENTRAL 1, # EIGHTRIUM @ CHANGI BUSINESS PARK SINGAPORE () Any profits tax will be paid by the winner. The prizes come with absolutely no warranty or support of any kind. The personal information requested (e-mail) are used only to contact the winner and will be removed after the contest has concluded.

        ROG LIVEASUS, intel CORE i9, intel CHIPSET Z

        THE LIVESTREAM HAS ENDED

        EVENT GIVEAWAYS

        Over US$25, in prizes

        • VIDEO SUBMISSION PRIZE

          VIDEO SUBMISSION PRIZE

          ROG Strix ZF Gaming WiFi Build

          • 11th Gen Intel® Core™ i7 processor
          • ROG Strix GeForce RTX OC

          Valued at US$3,

          Based on actual products

        • ROG QUIZ TOP PRIZE

          ROG QUIZ TOP PRIZE

          ROG Maximus XIII Hero Build

          • 11th Gen Intel® Core™ i9 processor
          • ROG Strix GeForce RTX OC

          Valued at US$6,

          Based on actual products

        • NAME THE BUILD PRIZE

          NAME THE BUILD PRIZE

          ASUS TUF Gaming ZPlus WiFi Build

          • 11th Gen Intel® Core™ i5 processor
          • ASUS TUF Gaming GeForce RTX 12GB

          Valued at US$ 2,

          Based on actual products

        Additional prizes

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        • Video Submission

          Now - April 10th

          Send a second video telling us why you need a new gaming PC — but without telling us you need a new gaming PC. Get creative or even silly with your submissions!

          An ROG panel will select the winning video from the entries.

          The winner of the video submission will receive a PC build valued at over US$3,.

          Enter now!
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          April 9thth

          This is your chance to show off all your hardware knowledge by participating in the three daily ROG Quizzes on Kahoot! Score points by answering questions correctly and fastest. Whoever scores the most points in the shortest amount of time at the end of the three days of quizzes will be crowned ROG Quiz champion!

          The overall winner will receive a new gaming PC valued at US$6,, while second and third runners-up will receive an ROG Strix OC graphics card and ROG Swift PGQNR monitor, respectively. There’s also a motherboard, gaming headset, and a gaming mouse up for grabs during each quiz.

          Make sure to check out the daily schedule for quiz times. Each session is limited to 2, participants, and all participation is on a first come, first served basis.

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          April 9thth

          Come up with a fun and creative name for the ASUS TUF Gaming ZPlus WiFi build … and post a screenshot of the stream on your social media with the suggested name for the PC build, along with the hashtags #ROGLive, #ASUSZ and #namethebuild.

          An ROG panel will select the winning name from the entries.

          The winner of the Name the Build contest will receive a PC build valued at over US$2,.

          The competition closes at CET on April 11 The winner will be announced before CET on the ROG Live stream on April 11

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        Sours: https://www.asus.com/Microsite/motherboard/Intel-Rocket-Lake-ZHBseries/

        Similar news:

        Intel Rocket Lake Price, Benchmarks, Specs and Release Date, All We Know

        Intel's 11th-Gen Rocket Lake is purportedly headed to the launch pad for blast off on March 30, promising to upset our list of Best CPUs for Gaming and CPU Benchmarks Hierarchy. Rocket Lake certainly couldn't come at a better time for Intel, either – AMD's Ryzen processors have thundered into the desktop PC market, upsetting Intel's Comet Lake chips and taking the lead in every metric that matters, including gaming.

        Intel's response comes in the form of Rocket Lake, and the company says the chips come with a 19% improvement in instruction per cycle (IPC) throughput and blistering GHz (+) clock speeds that will reestablish its performance leadership in gaming.

        Rocket Lake will bring the backported Cypress Cove architecture to the desktop PC, Intel's first new microarchitecture in six years. But unlike the forward progress we see with the company's 10nm Tiger Lake chips for laptops, Rocket Lake-S represents 14nm's last hurrah on the desktop and marks the seventh and final iteration of the longest-lived leading-edge node in Intel's history (it debuted in ).

        Intel's current integrated graphics are woefully inadequate for gaming, and we haven't seen a meaningful iGPU performance boost for desktop PCs since Kaby Lake arrived back in This changes with Rocket Lake, which comes with Intel's performant 12th-gen Xe graphics. Intel says the new engine doubles graphics performance over the previous-gen chips, bringing p-capable gaming (albeit with low fidelity settings) to mainstream CPUs. We do know that Intel has also plumbed in support for Resizable BAR, which boosts performance with discreet GPUs.

        Rocket Lake supports the PCIe interface, which provides twice the bandwidth of PCIe That addresses a key weakness exacerbated by AMD's now two-year-long advantage with its uncontested leadership position in I/O connectivity. Intel has also bumped up Rocket Lake's memory throughput to DDR, a nice step up from the prior gen's DDR

        So what's the catch? Rocket Lake tops out at eight cores and sixteen threads due to the backported architecture, a step back from the core Comet Lake i9 models. "Backporting" is a method that allows Intel to take a new design built on a smaller process node, in this case 10nm, and etch it on an older, larger node (in this case, 14nm).

        Intel backported the 10nm Sunny Cove cores found in Ice Lake processors to the less-dense 14nm process to create Rocket Lake's Cypress Cove architecture, leaving the chip designers with fewer transistors to make the new chips. As a result, Intel had to remove two cores; there simply wasn't enough room in the chip package for a larger die. Intel says it backported its Sunny Cove design from the 10nm process to its aging 14nm to create the new design, a necessity because 10nm couldn't support the higher frequencies needed for desktop PCs (we imagine yields might have played a role, too).

        That's an odd development in light of Intel's core Comet Lake flagships, not to mention that eight cores certainly feels inadequate in the face of AMD's core Ryzen 9 X. Intel admits that Rocket Lake's lowered core count can lead to reduced gen-on-gen performance in heavily-threaded applications, but the company is betting heavily on its 19% IPC gains and high clock speeds to offset the lower core counts. The Alder Lake hybrid chips will come in later to address the higher core count segment.

        Rocket Lake slots into Intel's 11th-gen processor family, but Intel is using refreshed Comet Lake chips for Core i3 (and lower) 11th-gen processors, which is another interesting development. Intel has slowly teased out the details of the Rocket Lake chips, but recently divulged the full details ahead of the review embargo lift later this month. Let's cover what we know so far.  

        Intel 11th-Gen Rocket Lake At a Glance

        • Maximum of eight cores, GHz peak boost speed
        • New Cypress Cove architecture featuring Ice Lake Core architecture and Tiger Lake Graphics architecture.
        • Support for PCIe - 20 lanes (four to storage)
        • New microarchitecture for the desktop
        • AVX, Thunderbolt 4 support
        • Intel plans to launch Rocket Lake on March 30,  
        • Intel 12th-gen Xe LP Graphics increase graphics performance by 50%
        • Support for DDR for Rocket Lake, DDR for Comet Lake Refresh
        • New overclocking features for more flexible tuning performance
        • Intel Deep Learning Boost and VNNI support
        • Backward compatible with series motherboards (caveats apply)

        Intel Rocket Lake Release Date and Availability

        Intel has given an official March 30, release window for Rocket Lake-S processors, and pre-orders are live now. It appears that Intel has solid availability of the chips, they're widely available for pre-order at retail outlets, signalling the company isn't encountering the same shortages we see with the competing high-end Ryzen processors.

        Intel also officially announced that its 10nm hybrid Alder Lake-S chips would launch in the second half of That timeline indicates that Rocket Lake will likely serve either as a short-lived stopgap or as part of a split product stack for the mainstream desktop, with the Alder Lake chips stepping in as the high core count flagships. The Alder Lake-S processors are thought to come with DDR5 and PCIe support, marking a big step forward for the desktop PC. 

        Intel 11th-Gen Rocket Lake Pricing and Specifications

        Product IdentifierSuggested PriceCores / ThreadsBase (GHz)Peak Boost (Dual/All Core)TDPiGPUL3
        Ryzen 9 X$16 / 32WNone64MB (2x32)
        Ryzen 9 X$12 / 24WNone64MB (2x32)
        Ryzen 7 X$8 / 16WNone32MB (1x32)
        RKL-S Core iK (KF)$ (K) - $ (KF)8 / 16 / (TVB) WUHD Graphics Xe 32EU16MB
        CML-S Core iK (KF)$ (K) / $ (KF)10 / 20 / (TVB) WUHD Graphics 20MB
        CML-S Core iK$10 / 20 / (TVB)WUHD Graphics 20MB
        RKL-S Core i (F)$ - $ (F)8 / 16 (TVB) / 65WUHD Graphics Xe 32EU16MB
        RKL-S Core iK (KF)$ (K) - $ (KF)8 / 16 (TB3) / WUHD Graphics Xe 32EU16MB
        CML-S Core iK (KF) $ (K) / $ (KF)8 / 16 (TB3) / WUHD Graphics 16 MB
        RKL-S Core i (F)$ -$ (F)8 / 16 (TB3) / 65WUHD Graphics Xe 32EU16MB
        Ryzen 5 X$6 / 1265WNone32MB (1x32)
        RKL-S Core iK (KF)$ (K) - $(KF)6 / 12 (TB2) / WUHD Graphics Xe 32EU12MB
        CML-S Core iK (KF)$ (K) / $ (KF) 6 / 12 (TB2) / WUHD Graphics 12MB
        RKL-S Core i (F)$ - $6 / 12 (TB2) / 65WUHD Graphics Xe 24EU12MB

        A flurry of leaked benchmarks have emerged from Asian regions, including full-on reviews of some Rocket Lake-S chips. However, while the specifications and pricing listed above are official, the leaked benchmarks are not. Most of the tests were conducted on Intel reference validation platforms (RVP), indicating the silicon was still under development. As per usual, it's best to wait until official reviews.

        As we can see above, Intel spreads the Rocket Lake (RKL-S) chips into the familiar Core i9, i7, and i5 families, but there's a fly in the ointment: Intel has decided to use refreshed Comet Lake (CML-R) chips for its Core i3 and Pentium families. Those chips feature the same architecture as other Comet Lake chips but come with slightly increased clock speeds.

        As before, Intel offers graphics-less F-series models across its Core i9, i7, i5, and i3 families. The F-series models come with the same clock speeds and other features as the fully-featured models.

        The eight-core thread flagship Core iK comes with a suggested $ price tag, a $51 markup over the previous-gen ten-core K, but you pay the premium for two fewer cores. The K is also more expensive than the $ Ryzen 9 X. Even more concerning, the ten-core Core iK, which has nearly identical performance to the K, weighs in at a mere $, opening up a much larger $86 gap. Intel's performance benchmarks, which we'll get to shortly, tout faster gen-on-gen gaming performance, but the value proposition looks dicey. Of course, our own benchmarks will tell the tale.

        Two of the K's cores boost to a peak of GHz, and all cores can operate at GHz simultaneously. These are Thermal Velocity Boost frequencies that only activate if the processor is under a certain temperature limit, but most motherboard makers ignore those limits. That means the chips will likely operate at these speeds regardless of chip temperature, at least on higher-end motherboards. Intel has listed a W PL1 power rating (at the base frequency) for the K, a 25W increase over the K, but it has an identical W PL2 (boost) rating.

        Intel has confirmed the chips feature a W PL1 power rating (at the base frequency), a 25W increase over the K, and an identical W PL2 (boost) rating. Intel has also bumped up Rocket Lake's memory throughput to DDR, a nice step up from the prior gen's DDR, but here's where things get tricky: The Core iK is the only Rocket Lake chip that supports DDR memory in the optimal configuration at stock settings, which is called 'Gear 1.'  This setting allows the memory controller and memory frequency to operate at the same speed (), thus providing the lowest latency and best performance in lightly-threaded work, like gaming.   

        All other Rocket Lake chips only officially support DDR with the 'Gear 2" setting, which downshifts the memory controller so that it operates at half the frequency of the memory (). This setting trades higher memory latency (i.e., reduced performance in single-threaded work) for improved bandwidth, which can benefit a narrow selection of multi-threaded workloads. 

        For all other SKUs, the official top speed for the Gear 1 setting is DDR, and running DDR in lower-latency Gear 1 mode is considered overclocking, which voids your warranty. Intel isn't sharing latency information to detail the differences between the two modes and how that impacts performance, so we'll have to suss that out in our review.

        The $ Core iK slots into the huge pricing gap between the $ Ryzen 5 X and $ Ryzen 7 X. Core counts are no longer the delineating feature between the Core i9 and Core i7 families; instead, we're left with a few bins of frequency and the differences in Gear modes. Like the K, the K chip comes with eight cores and 16 threads, but it doesn't have the Thermal Velocity Boost tech. As such, the K tops out 5 GHz on two cores via Turbo Boost 3, while all-core frequency stretched up to GHz. 

        The gen-on-gen price increase for the K is lower, but still present. At $, Intel commands a $25 premium over the previous-gen K that comes with the same number of cores and slightly higher boost frequencies. 

        Intel's non-K Core i9 and i7 models carry the same pricing as their prior-gen counterparts, and pricing is also normalized with the $ six-core Core iK, which matches the pricing of the previous-gen iK. This chip boosts to a peak of GHz on two cores and can maintain a GHz all-core frequency. The Core iK is a key model for Intel, as it contends directly with the $ Ryzen 5 X in the heart of the mainstream gaming market.

        The Core i also stands out as a potentially great deal, with $ (or $ for the F-series part) being a solid price for a six-core thread processor. 

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        Here's the full list of both the Rocket Lake and Comet Lake Refresh SKUs. Intel's Comet Lake Refresh, which is comprised of models with slightly faster clock speeds than their predecessors, slot in for the Core i3 and Pentium families. These chips come with the same pricing as their predecessors, along with the same Comet Lake architecture and UHD Graphics engine. Given the slight performance improvements, which are on the order of MHz for any given SKU, these chips are largely unimpressive. 

        Here's a guide to the different boost technologies that come with the Rocket Lake processors:

        • Turbo Boost Increased frequency if chip operates below power, current, and temperature specifications.
        • Turbo Boost Max Fastest cores are identified during binning, then the Windows scheduler targets the fastest two active cores (favored cores) with lightly-threaded applications. Chip must be below power, current, and temperature specifications.
        • Single-Core Thermal Velocity Boost: Fastest active favored core can boost higher than Turbo Boost Max if below a pre-defined temperature threshold (70C) and all other factors adhere to TB conditions. 
        • All-Core Thermal Velocity Boost: Increases all-core frequency when all cores are active and the chip is under 70C. 

        Intel 11th-Gen Rocket Lake Gaming Benchmarks

        Intel has slowly teased bits of info about Rocket Lake, but here's probably the most important new detail: Intel shared benchmarks that say the 8C/16T Core iK reclaims the gaming performance crown from AMD's Ryzen 9 X at p. As always, we should approach vendor-provided benchmarks with caution.

        Intel's wins are slim, though. Intel ran these tests with an EVGA RTX XC3 graphics card, and the company's claimed lead ranges from 2% to 8% (roughly a 4% advantage overall). That paints a picture of a closely-contested battle in gaming performance between Rocket Lake and Zen 3, particularly at higher resolutions.

        Intel's traditionally higher overclocking ceilings could prove to be an advantage against the Ryzen processors — it's important to remember that Intel tested the Rocket Lake chip at stock settings. If these slim deltas play out in our testing and the Intel chips overclock well, pricing might be the determining factor if you're on the hunt for a gaming processor in

        We've also seen benchmark submissions from a Rocket Lake chip overclocked to GHz on liquid nitrogen, along with a string of benchmarks conducted on engineering samples, but we should keep in mind that these are pre-production chips and might not fully encapsulate the performance we'll see when the chips come to retail. 

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        Inteal provided a full batch of new benchmarks for the official launch announcement, but these are a bit questionable. Intel listed the PL1 rating, which is the power consumption measured at base frequencies, as W for all Rocket Lake processors in its gaming tests. This represents a W increase over Intel's W PL1 spec (W is the PL2 rating -power during boost), which essentially grants the processors an infinite boost (tau) duration and allows them to operate at higher levels of performance. Meanwhile, the company assigned the competing Ryzen processor at its standard W PL1 and the Comet Lake models to a W PL1, meaning we're looking at a lopsided battle. All other variables for the testing were similar between the test systems.

        Intel compared the Core iK to the Ryzen 9 X, which currently tops our CPU benchmarks as the fastest gaming chip on the market, in a narrow selection of titles at p High settings. Intel claims a 10% advantage over the Ryzen 9 X in the Total War Kingdoms Dynasty benchmark, 9% higher fps in Gears 5, an 8% advantage in GRID , and an 11% lead in Microsoft Flight Simulator

        Intel also presented gaming benchmarks showing the gen-on-gen performance gains of the Core iK against the K, and the Core iK against the K. As you would imagine, Intel recorded strong generational gains.

        Intel's final slide plays up its strong partnerships with several game developers, through which it helps optimize their game engines for Intel processors. Bear in mind that three of the four titles used for Intel's gaming benchmarks are listed. For a perspective of the current state of gaming performance, we included a few of our own gaming benchmarks at the end of the album with the current Comet Lake and Ryzen lineups.

        Intel Rocket Lake Cypress Cove Architecture

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        Intel finally confirmed one tidbit that wasn't entirely clear: The new chips feature the backported Cypress Cove architecture, its first new microarchitecture for the desktop PC since Skylake arrived back in Intel says this new architecture is based on Ice Lake's 'Sunny Cove' architecture and also comes with the same performant 12th-gen Intel Xe LP graphics engine found in the Tiger Lake processors. 

        "Back-porting" is a method that allows Intel to take a new design built on a smaller process node, in this case 10nm, and etch it on an older, larger node (in this case 14nm). The chips come with a new microarchitecture, but they still leverage Intel's 14nm process, although we don't know which revision (14nm++++?).

        Rocket Lake also marks Intel's first desktop PC chips that support the PCIe interface, a needed addition that comes two long years after AMD led the industry with the first PC chips to support the interface. Intel also reworked the internal PCIe subsystem to accommodate a x4 direct connection (the chips now support 20 lanes) for M.2 SSDs to the CPU. The chip also exposes 16 lanes to the system. Despite the fact that Intel widened the DMI bus, it still operates at speeds similar to PCIe Additionally, the series chipset only supports 24 lanes of PCIe connectivity — not PCIe  Intel says this is because it had PCIe IP ready for its chip, but not for the chipset.

        Intel also widened the DMI connection (the pathway that connects the CPU and chipset) from four lanes to eight, doubling throughput up to a theoretical ~ GB/s. However, caveats apply when it comes to support with previous-gen motherboards, which we'll cover below. The wider DMI connection should help with bottlenecks for devices attached to the chipset, like SSDs in RAID. The chipset also now features an integrated USB Gen 2x2 controller, doubling support over the existing interface to 20Gbps. 

        Intel also touted support for its Deep Learning Boost (DLBoost) and VNNI features, which require support for AVX instructions. Both DLBoost and VNNI will enhance performance in workloads that leverage AI algorithms. 

        Enthusiasts can also look forward to new overclocking features, which would be helpful as Intel's overclocking headroom, while shrinking, still tends to be a big advantage over AMD's chips. Intel has also revamped its eXtreme Tuning Utility (XTU) with a new, fresher look and added new features to enable Rocket Lake's new overclocking options. That includes new overclocking offsets, like a separate AVX offset and the ability to set voltage guardbands for the different flavors of AVX. Intel also added an option to completely disable AVX support, though that feature is primarily geared for professional overclockers. 

        Dan Ragland, Intel's principle overclocking engineer, says that most users can expect similar overclocked CPU frequencies to the 10th-Gen Comet Lake processors. That equates to a common ceiling of a GHz all-core overclock (with AVX offsets applied) on most Rocket Lake chips, though the silicon lottery does apply. With more robust cooling, Ragland claims users with cherry chips can add a few more hundred megahertz to that total, albeit on a limited number of cores. 

        Although Rocket's overclocking ceilings are very similar to Comet Lake, the increased IPC should result in larger performance gains, comparatively. Like the Comet Lake chips, Rocket also supports per-core frequency and hyper-threading control (enable/disable) to help eke out more overclocking headroom. 

        Intel has also added support for real-time memory frequency adjustments, though motherboard support will vary by model and vendor. This feature allows you to shift from, say, DDR, for example, to DDR from within Windows 10 without rebooting. Intel also continues to support its existing mechanism for live memory timing adjustments from within the operating system, giving users a plethora of on-the-fly memory overclocking options. Overall, Ragland says he thinks that Rocket Lake's memory controllers, which are entirely new, coupled with the expanded memory overclocking features, will help topple many of the existing world records. 

        Intel's overclocking headroom, while shrinking, still tends to be a big advantage over AMD's chips. Intel also helped develop new sub-ambient coolers from EKWB QuantumX Delta TEC and Cooler Master MasterLiquid ML Sub-Zero to bring extreme cooling to the masses, but these are somewhat expensive and exotic solutions for very specific uses, which you can read about here. 

        Intel also added new features to the graphics engine, with new HEVC, VP9, and SCC encoders that support up to 4K60 12b and hardware-accelerated AV1 support for 4K60 10b. Keep your eye on AV1; this seems to be the looming industry standard. Intel also touts the increased display resolution, with now stretches up to three screens at 4K60 or two screens at 5K 

        Intel's Rocket Lake Die Shots and Comparisons

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        We aren't prepared to potentially sacrifice our sample by doing a risky delid yet, but luckily a daring enthusiast recently delidded a Core iK processor and shared the results at the Overlock.net forums. Unfortunately, the processor didn't live through the procedure, but we can get a good sense of the size of Rocket Lake's die through a photo lineup compiled from Der8auer's excellent die analysis article (via @harukaze).

        Intel has confirmed that all Rocket Lake-S chips come with the same eight-core die, with two cores disabled for the six-core models. Surprisingly, based on our rough projections, Rocket Lake's eight-core die is about 34% larger than the ten-core Comet Lake die. 

        GenerationModelCoresDie Size
        Rocket Lake-SCore iKEight mm2
        Comet Lake-SCore iKTen mm2
        Coffee Lake-S RefreshCore iKEight mm2
        Coffee Lake-SCore iKSix mm2

        Intel chalks much of this disparity up to GPU and CPU cores that are physically larger than those found on Comet Lake, a byproduct of backporting from 10nm to 14nm, along with the increased number of graphics EUs. Intel could have shrunk or removed the integrated graphics engine to cram in more CPU cores to meet its power, performance, area, and cost (PPAC) targets, but integrated graphics are a key requirement for the high-volume OEM systems market that tends to leverage on-chip graphics rather than discrete GPUs. 

        Intel's 14nm process is ultra-mature, so we assume yields are well in line and the majority of its chipmaking equipment is depreciated. However, fabbing a larger die exposes the chips to a greater chance of defects, thus complicating the binning process, and also results in fewer die per wafer. All of these factors increase cost, which could help explain Intel's higher pricing for its highest-binned SKUs. 

        The company hasn't shared the Cypress Cove architecture's deep-dive details yet, but chip detective @Locuza_ shared the following Rocket Lake-S die annotation. We caution that Intel hasn't confirmed the marked units, but the arrangement aligns with our general expectations of the new design. 

        Intel has made significant alterations to the L2 and L3 caches – we now have a KB  of L2 cache, a doubling over Skylake, and 16MB of L3 spread across eight 2MB slices. The L1I and L1D caches remain similar to those found on Skylake. 

        Even though the images aren't scaled similarly, we can also see that the Xe LP graphics cores appear to be much smaller than those found on Tiger Lake. However, that isn't entirely unexpected: The Rocket Lake chips purportedly come with up to 32 EUs, while Tiger Lake scales up to 96 EUs. We can also see that the uncore is much larger than that of the Tiger Lake-U die used for comparison, which isn't surprising given the support for 20 lanes of PCIe  

        Intel 11th-Gen Core Rocket Lake Xe Graphics

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        Most Rocket Lake chips come with the UHD Graphics engine powered by 32 EUs with the Xe architecture. Intel has carved the Xe LP graphics engine into UHD Graphics (GT1) with 32 EUs and UHD Graphics (GT1) with 24 EUs. The latter makes an appearance on the Core i (T and F) chips. Intel also added new features to the graphics engine, with HEVC, VP9, and SCC encoders that support up to 4K60 12b and hardware-accelerated AV1 encode support for 4K60 10b. 

        Intel dedicated more die area to the graphics engine than it did with Comet Lake, noting that not only has it increased the number of EUs from 24 to 32, but the EUs are also physically larger than prior 14nm EUs. The increased iGPU real estate was a factor in Rocket's limitation of eight CPU cores. 

        Intel bases its 50% generational iGPU performance improvement claim on the 3DMark Firestrike GPU benchmark, and as with all synthetic gaming tests, those results don't often translate well to real-world gaming. As such, you should take those predictions with a grain of salt.

        As before, you're free to overclock the graphics engine and it also benefits from increased memory bandwidth, so memory overclocking pays dividends. 

        Intel 11th-Gen Rocket Lake Motherboard Support

        Intel has now enabled memory overclocking on its B and H chipsets, and that will work with any chip that is compatible with the platform, meaning all 10th-Gen Comet Lake, 11th-Gen Rocket Lake, and 11th-Gen Comet Lake Refresh processors. Intel is also adding support for Resizable Bar on all series chipsets, provided the discrete GPU has a driver that supports the feature. Resizeable Bar enables faster gaming performance in some game titles by allowing the CPU to access the GPUs full frame buffer across the PCIe interface.

        Can you use your series motherboard for Rocket Lake processors? Yes, but serious caveats apply. 

        The Rocket Lake-S chips are backward compatible with most series chipsets. The LGA socket adheres to the same physical dimensions, and PCIe will work on existing motherboards that support the interface. However, Rocket Lake-S isn't compatible with the H and B chipsets because they use a different 22nm chipset. 

        Rocket Lake's wider x8 DMI connection is only active on 'select' series chipsets, so the chip defaults to a x4 connection on B and H motherboards. The same x4 connection applies for Rocket Lake processors in series motherboards. 

        Most Comet Lake chips are forward-compatible with the new series motherboards that debuted recently, the lone exception being Celeron models with 2MB of CPU cache. There are a few restrictions, though: Comet Lake chips also only use a x4 DMI connection on all series motherboards. 

        Socket motherboards will be short-lived. According to Intel's own documentation, the hybrid Alder Lake-S processors that arrive in the latter half of will drop into Socket That means there will be no forward compatibility for Socket motherboards with future Intel processors. 

        We have a deeper dive into the chipset and coverage of all forty-five Z motherboards for Rocket Lake and Comet Lake processors here. You can also follow this link to see the differences between Intel's Z, H, B, and H chipsets. 

        Given that the Rocket Lake series motherboards come with the same physical LGA socket dimensions as the series, existing LGA coolers should be compatible between the two series. In fact, Noctua has already begun to prepare its compatibility matrix. Thus far, the list spans over thirty Z and eleven B motherboards.

        Rocket Lake is poised for liftoff soon, and we'll update this article as new details come to light. 

        Paul Alcorn is the Deputy Managing Editor for Tom's Hardware US. He writes news and reviews on CPUs, storage and enterprise hardware.

        Sours: https://www.tomshardware.com/news/intel-rocket-lake-release-date-specifications-performance-all-we-know


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